1. Dielectric layer (Dielectric): It is used to maintain the insulation between lines and layers, commonly known as the substrate. 2. Silkscreen (Legend/Marking/Silkscreen): This is a non-essential component. Its main function is to mark the name and position box of each part on the circuit board, which is convenient for maintenance and identification after assembly. 3.Surface treatment (SurtaceFinish): Since the copper surface is easily oxidized in the general environment, it cannot be tinned (poor solderability), so the copper surface to be tinned will be protected. The protection methods include HASL, ENIG, Immersion Silver, Immersion TIn, and organic solder preservative (OSP). Each method has its own advantages and disadvantages, collectively referred to as surface treatment.● -Reliability testing ● -Traceability ● -Thermal management ● -Heavy copper ≥ 105um ● -HDI ● -Semi - flex ● -Rigid - flex ● -High frequency milimeter microwave

Layers	Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness	Mass production: 394mil (10mm) / Pilot run: 17.5mm
Material	FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,  PPO, PPE, Hybrid, Partial hybrid, etc.
Min. Width/Spacing	Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness	UL certificated: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size	Mechanical drill: 8mil(0.2mm)  Laser drill: 3mil(0.075mm)
Max. Panel Size	1150mm × 560mm
Aspect Ratio	18:1
Surface Finish	HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process	Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control