1) Years of experience in half-hole production, using Da Chuan Routing machine, routing the half- hole then routing the shape, meet the strict shape requirements; 2) Minimum line width and line spacing: 0.065/0.065mm, minimum BGA pad: 0.2mm, meet customer's special needs; 3) Electroplated Copper Flling of Blind Holes by Universal DVCP(Double Track Vertical Continuous Copper Plating Equip ment) to ensure that there are no voids in the holes and quality of customer products; 4) Strict sampling inspection mode, guarantee customers' product yield.● Material: Fr-4 ● Layer Count: 6 layers ● PCB Thickness: 1.2mm ● Min. Trace / Space Outer: 0.102mm/0.1mm ● Min. Drilled Hole: 0.1mm ● Via Process: Tenting Vias ● Surface Finish: ENIG

SMT	Position accuracy:20 um
	Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
	Max. component height::25mm
	Max. PCB size:680×500mm
	Min. PCB size:no limited
	PCB thickness:0.3 to 6mm
	PCB weight:3KG
Wave-Solder	Max. PCB width:450mm
	Min. PCB width: no limited
	Component height:Top 120mm/Bot 15mm
Sweat-Solder	Metal type :part, whole, inlay, sidestep
	Metal material:Copper , Aluminum
	Surface Finish:plating Au, plating sliver , plating Sn
	Air bladder rate:less than 20%
Press-fit	Press range:0-50KN
	Max. PCB size:800X600mm
Testing	ICT,Probe flying,burn-in,function test,temperature cycling