One-stop PCB and PCBA electronic manufacturing services 1.PCB manufacturing service：  Need Gerber file(CAM350 RS274X), PCB files(Protel 99,AD,Eagle),etc 2.Components sourcing services ：BOM list included detailed Part number and Designator 3.PCB assembly services ：The above files and Pick and Place files,assembly drawing 4.Programming & Testing services ：Program,instrouction and test method etc. 5.Housing assembly services： 3D files，step or others 6.Reverse engineering services： Samples and others 7.Cable & wire assembly services ：Specification & others 8.Others services： Value-added services● -Layer Count: 2L/4L/6L/8L/10L ● -Max. Delivery Panel Size: 699mm×594mm ● -Max. Copper Weight (Inner/Outer Layer): 12oz ● -Max.Board Thickness: 5.0mm ● -Max. Aspect Ratio: 15:1 ● -Surface Finish: LF-HASL, ENIG, Imm-Ag, Imm-Sn, OSP, ENEPIG, Gold Finger

Layers	Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness	Mass production: 394mil (10mm) / Pilot run: 17.5mm
Material	FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,  PPO, PPE, Hybrid, Partial hybrid, etc.
Min. Width/Spacing	Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness	UL certificated: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size	Mechanical drill: 8mil(0.2mm)  Laser drill: 3mil(0.075mm)
Max. Panel Size	1150mm × 560mm
Aspect Ratio	18:1
Surface Finish	HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process	Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control