● Our Services: One-stop PCB and PCBA electronic manufacturing services ● PCB manufacturing service: Need Gerber file(CAM350 RS274X), PCB files (Protel 99, AD, Eagle), etc ● Components sourcing services: BOM list included detailed Part number and Designator ● PCB assembly services: The above files and Pick and Place files, assembly drawing ● Programming & Testing services: Program, instrouction and test method etc. ● Housing assembly services: 3D files, step or others ● Reverse engineering services: Samples and others ● Cable & wire assembly services: Specification & others ● Others services: Value-added services● -HDI/Any-layer/mSAP ● -Fine line and multilayer manufacture capability ● -Advanced SMT and after assembly equipment ● -Exquisite craft ● -Isolated function test capability ● -Low loss material ● -5G Antenna Experience

Layers	Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness	Mass production: 394mil (10mm) / Pilot run: 17.5mm
Material	FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,  PPO, PPE, Hybrid, Partial hybrid, etc.
Min. Width/Spacing	Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness	UL certificated: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size	Mechanical drill: 8mil(0.2mm)  Laser drill: 3mil(0.075mm)
Max. Panel Size	1150mm × 560mm
Aspect Ratio	18:1
Surface Finish	HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process	Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control