1. Circuit and pattern (Pattern): The circuit is used as a tool for conducting between components. In the design, a large copper surface will be designed as a grounding and power supply layer. Lines and drawings are made at the same time. 2. Hole (Throughole/via): The through hole can make the lines of more than two levels conduct each other, the larger through hole is used as a component plug-in, and the non-conductive hole (nPTH) is usually used as the surface Mounting and positioning, used for fixing screws during assembly. 3. Solderresistant ink (Solderresistant/SolderMask): Not all copper surfaces have to eat tin parts, so the non-tin-eaten area will be printed with a layer of material (usually epoxy resin) that isolates the copper surface from eating tin to avoid non-soldering. There is a short circuit between the tinned lines. According to different processes, it is divided into green oil, red oil and blue oil. 4. Dielectric layer (Dielectric): It is used to maintain the insulation between lines and layers, commonly known as the substrate.● Material: Fr-4 ● Layer Count: 6 layers ● PCB Thickness: 1.2mm ● Min. Trace / Space Outer: 0.102mm/0.1mm ● Min. Drilled Hole: 0.1mm ● Via Process: Tenting Vias ● Surface Finish: ENIG
