1. (A) 4-layer board base material is mainly epoxy resin glass fber cloth. Main applications are personal computers, medical ! electronic equipment, measuring instruments, semiconductor testing machines, numerical control machines, electronic switches, communication machines, memory circuit boards, IC cards, etc. 2. (B) 6-8 layer board substrate material is still mainly epoxy resin glass fber cloth. Most of them are used in electronic switches, semiconductor testers, mid-range personal computers, engineering workstations, and other machines. 3. (C) 10-layer board material above the material is mainly glass benzene resin material or epoxy resin as a multi-layer PCB substrate material. The application of this type of PCB is more special, used in large industrial computers, high-speed computers, defense machines, communication machines, etc.● -Multilayer heavy copper ● -6oz UL approved copper thickness ● -Copper coin inlay ● -Coil design ● -Inductance testing ● -Hi-Pot testing ● -Capacitance testing ● -DCR testing

SMT	Position accuracy:20 um
	Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
	Max. component height::25mm
	Max. PCB size:680×500mm
	Min. PCB size:no limited
	PCB thickness:0.3 to 6mm
	PCB weight:3KG
Wave-Solder	Max. PCB width:450mm
	Min. PCB width: no limited
	Component height:Top 120mm/Bot 15mm
Sweat-Solder	Metal type :part, whole, inlay, sidestep
	Metal material:Copper , Aluminum
	Surface Finish:plating Au, plating sliver , plating Sn
	Air bladder rate:less than 20%
Press-fit	Press range:0-50KN
	Max. PCB size:800X600mm
Testing	ICT,Probe flying,burn-in,function test,temperature cycling