1. Circuit and pattern (Pattern): The circuit is used as a tool for conducting between components. In the design, a large copper surface will be designed as a grounding and power supply layer. Lines and drawings are made at the same time. 2. Hole (Throughole/via): The through hole can make the lines of more than two levels conduct each other, the larger through hole is used as a component plug-in, and the non-conductive hole (nPTH) is usually used as the surface Mounting and positioning, used for fixing screws during assembly. 3. Solderresistant ink (Solderresistant/SolderMask): Not all copper surfaces have to eat tin parts, so the non-tin-eaten area will be printed with a layer of material (usually epoxy resin) that isolates the copper surface from eating tin to avoid non-soldering. There is a short circuit between the tinned lines. According to different processes, it is divided into green oil, red oil and blue oil. 4. Dielectric layer (Dielectric): It is used to maintain the insulation between lines and layers, commonly known as the substrate.● Material: Fr-4 ● Layer Count: 6 layers ● PCB Thickness: 1.2mm ● Min. Trace / Space Outer: 0.102mm/0.1mm ● Min. Drilled Hole: 0.1mm ● Via Process: Tenting Vias ● Surface Finish: ENIG

SMT	Position accuracy:20 um
	Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
	Max. component height::25mm
	Max. PCB size:680×500mm
	Min. PCB size:no limited
	PCB thickness:0.3 to 6mm
	PCB weight:3KG
Wave-Solder	Max. PCB width:450mm
	Min. PCB width: no limited
	Component height:Top 120mm/Bot 15mm
Sweat-Solder	Metal type :part, whole, inlay, sidestep
	Metal material:Copper , Aluminum
	Surface Finish:plating Au, plating sliver , plating Sn
	Air bladder rate:less than 20%
Press-fit	Press range:0-50KN
	Max. PCB size:800X600mm
Testing	ICT,Probe flying,burn-in,function test,temperature cycling

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